ACST4-7SB footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

ACST4-7SB - STMicroelectronics PCB footprint - Other - Other - DPAK_2025-2.1

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Part Number ACST4-7SB
Manufacturer STMicroelectronics
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - DPAK_2025-2.1
Released Date Dec 1, 2025
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

ACST4-7SB Details

Manufacturer Part Number:
ACST4-7SB
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
TO-252
Package Description:
ROHS COMPLIANT, PLASTIC, DPAK-3
Pin Count:
3
ECCN Code:
EAR99
HTS Code:
8541.30.00.80
Manufacturer:
STMicroelectronics
YTEOL:
0
Case Connection:
MAIN TERMINAL 1
Configuration:
SINGLE
Critical Rate of Rise of Off-State Voltage-Min:
200 V/us
DC Gate Trigger Current-Max:
10 mA
DC Gate Trigger Voltage-Max:
1 V
Holding Current-Max:
20 mA
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Leakage Current-Max:
0.5 mA
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-30 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Qualification Status:
Not Qualified
RMS On-state Current-Max:
4 A
Repetitive Peak Off-state Voltage:
700 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Trigger Device Type:
4 QUADRANT LOGIC LEVEL TRIAC

ACST4-7SB Frequently Asked Questions (FAQs)

A good PCB layout for the ACST4-7SB should include a large copper area for heat dissipation, with multiple vias connecting the thermal pad to the copper plane. This helps to reduce thermal resistance and improve heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
The recommended soldering conditions for the ACST4-7SB are a peak temperature of 260°C, with a soldering time of 10-15 seconds. It's essential to follow these conditions to prevent damage to the device.
To protect the ACST4-7SB from ESD, it's essential to follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, ensure that the device is properly grounded during assembly and testing.
Exceeding the maximum junction temperature of 150°C can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability.

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ACST4-7SB Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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