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AR8031-AL1B-R - Qualcomm

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Symbol
AR8031-AL1B-R - Qualcomm - PCB symbol
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PCB Footprints
AR8031-AL1B-R - Qualcomm PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-pin 6 × 6 mm QFN
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3D Models
AR8031-AL1B-R - Qualcomm - 3D model - Quad Flat No-Lead - 48-pin 6 × 6 mm QFN
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AR8031-AL1B-R Details

  • Manufacturer Part Number:

    AR8031-AL1B-R

  • Part Life Cycle Code:

    Active Unconfirmed

  • Part Package Code:

    QFN

  • Package Description:

    QFN-48

  • Pin Count:

    48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Qualcomm

  • YTEOL:

    2

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    113.7 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

AR8031-AL1B-R Frequently Asked Questions (FAQs)

  • Qualcomm provides a recommended PCB layout guide for the AR8031-AL1B-R, which includes guidelines for component placement, routing, and thermal management. It's essential to follow this guide to ensure optimal performance and reliability.
  • To minimize power consumption, configure the AR8031-AL1B-R to use the lowest possible voltage and frequency settings. Additionally, use the device's power-saving features, such as dynamic voltage and frequency scaling, and enable low-power modes when possible.
  • The AR8031-AL1B-R has a maximum junction temperature of 125°C. Ensure good thermal conductivity between the device and the PCB, and use thermal pads or heat sinks if necessary. Keep the device away from heat sources and ensure good airflow around the PCB.
  • Use Qualcomm's debugging tools and software development kits (SDKs) to troubleshoot issues with the AR8031-AL1B-R. Check the device's registers and logs for error messages, and use oscilloscopes or logic analyzers to monitor signal integrity.
  • Follow Qualcomm's guidelines for electromagnetic interference (EMI) and electromagnetic compatibility (EMC) when designing the PCB and integrating the AR8031-AL1B-R. Use shielding, filtering, and grounding techniques to minimize EMI and ensure EMC compliance.

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AR8031-AL1B-R Overview

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