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AT25DN011-XMHF-T - Renesas Electronics

Description: The AT25DN011 is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer-based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25DN011, with its page erase granularity it is ideal for data storage as well, eliminating the need for additional data storage devices.

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PCB Footprints
AT25DN011-XMHF-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
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3D Models
AT25DN011-XMHF-T - Renesas Electronics  - 3D model - Small Outline Packages - 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
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AT25DN011-XMHF-T Details

  • Manufacturer Part Number:

    AT25DN011-XMHF-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    104 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.4 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    DSPI

  • Standby Current-Max:

    0.000015 A

  • Supply Current-Max:

    0.018 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    3 mm

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored

AT25DN011-XMHF-T Overview

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