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AU5790D - NXP

Description: PDSO8

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Symbol
AU5790D - NXP - PCB symbol
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PCB Footprints
AU5790D - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT96-1
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3D Models
AU5790D - NXP - 3D model - Small Outline Packages - SOT96-1
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AU5790D Details

  • Manufacturer Part Number:

    AU5790D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SO-8

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Data Rate:

    100 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.045 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AU5790D Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane, separate power and ground planes for analog and digital sections, and a decoupling capacitor (e.g., 10uF) close to the VDD pin is recommended.
  • Use a reliable communication protocol (e.g., SPI or I2C), ensure proper signal termination, and add a 100nF capacitor between the SCL/SDA lines and GND to filter out noise.
  • The AU5790D operates from -40°C to 125°C (junction temperature), but the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
  • Connect a 10kΩ resistor between the POR pin and VDD, and a 10nF capacitor between the BOD pin and GND. This ensures proper reset and brown-out detection functionality.
  • Use a shielded enclosure, add EMI filters (e.g., ferrite beads) on the power lines, and include ESD protection diodes (e.g., TVS diodes) on the I/O lines to ensure reliable operation in harsh environments.

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AU5790D Overview

Use the download button to access the AU5790D schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AU579, or try a keyword search, such as Network Interfaces

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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