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BAT18 - NXP

Description: 35 V, SILICON, PIN DIODE, TO-236AB

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PCB Footprints
BAT18 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3 lead sot-23
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3D Models
BAT18 - NXP  - 3D model - SOT23 (3-Pin) - 3 lead sot-23
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BAT18 Details

  • Manufacturer Part Number:

    BAT18

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SMD, 3 PIN

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Application:

    SWITCHING

  • Breakdown Voltage-Min:

    35 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1 pF

  • Diode Capacitance-Nom:

    0.8 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.7 Ω

  • Diode Res Test Current:

    5 mA

  • Diode Res Test Frequency:

    200 MHz

  • Diode Type:

    PIN DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAT18 Frequently Asked Questions (FAQs)

  • The BAT18 can operate from -65°C to 175°C, but the maximum junction temperature (Tj) should not exceed 150°C for reliable operation.
  • The BAT18 has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
  • The recommended soldering temperature for the BAT18 is between 240°C to 260°C, with a maximum soldering time of 10 seconds. It's also recommended to use a soldering iron with a temperature control and a solder with a melting point above 217°C.
  • Yes, the BAT18 can be used in switching regulator applications, but it's essential to ensure that the diode is properly snubbed to prevent voltage spikes and ringing. A snubber circuit can be added to reduce the voltage stress on the diode.
  • The power dissipation of the BAT18 can be calculated using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current. The maximum power dissipation should not exceed the rated power dissipation of 500 mW.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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