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BF998 - NXP

Description: MOSFET, N, RF, DUAL-GATE, SOT-143B

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PCB Footprints
BF998 - NXP PCB footprint - Other - Other - SOT143B
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BF998 - NXP  - 3D model - Other - SOT143B
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BF998 Details

  • Manufacturer Part Number:

    BF998

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICRO MINIATURE, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    0.03 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    DUAL GATE, DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF998 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BF998 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the BF998 for low noise performance, use a low-noise voltage regulator, decouple the supply lines with 10nF and 100nF capacitors, and keep the input and output tracks away from each other. Additionally, use a shielded enclosure and minimize the number of external components.
  • The maximum power dissipation of the BF998 is 1.2W. However, this can be increased to 2.5W with proper heat sinking and a maximum junction temperature of 150°C.
  • Yes, the BF998 can be used in a push-pull configuration, but it requires careful design and layout to ensure stability and prevent oscillations. A common-mode choke and a shielded transformer are recommended to minimize electromagnetic interference.
  • To protect the BF998 from overvoltage and ESD, use a voltage regulator with overvoltage protection, add a TVS diode or a zener diode to the supply line, and ensure that the PCB has adequate ESD protection measures such as ESD diodes and resistors.

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BF998 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BF998-T NXP Semiconductors

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Part Image 934002660215 NXP Semiconductors

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For a full list of alternate parts for BF998, check out Findchips.com