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BGM1013 - NXP

Description: MMIC AMPLIFIER 6TSSOP

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PCB Footprints
BGM1013 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - Package outline SOT363 (SC-88)
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3D Models
BGM1013 - NXP  - 3D model - SOT23 (6-Pin) - Package outline SOT363 (SC-88)
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BGM1013 Details

  • Manufacturer Part Number:

    BGM1013

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, SC-88, SOT-363, 6 PIN

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    24 dB

  • Input Power-Max (CW):

    -10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    3000 MHz

  • Operating Frequency-Min:

    100 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    33 mA

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin (Sn)

BGM1013 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11917, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The BGM1013 can be configured for different frequency bands by adjusting the values of the external components, such as the inductors and capacitors, according to the specific frequency band requirements. NXP provides a frequency band selection guide in the datasheet.
  • The BGM1013 is designed to handle a maximum input power of +30 dBm (1 W) and can operate with a maximum output power of +25 dBm (316 mW). However, the actual power handling capability may vary depending on the specific application and operating conditions.
  • Impedance matching can be achieved using a pi-network or a T-network topology, depending on the specific application requirements. NXP provides guidelines for impedance matching in the application note AN11917.
  • The BGM1013 is specified to operate over a temperature range of -40°C to +85°C, making it suitable for a wide range of industrial and commercial applications.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BGM1013,115 NXP Semiconductors

Wide Band Low Power Amplifier, 100MHz Min, 3000MHz Max, 1 Func, BIPolar