BTS134D footprint, schematic symbol and 3D model by Infineon

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PCB Footprints

BTS134D - Infineon PCB footprint - Other - Other - PG-TO252-3-11_2024-3

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Part Number BTS134D
Manufacturer Infineon
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - PG-TO252-3-11_2024-3
Released Date Sep 7, 2024
Last Modified Date Sep 7, 2024 2:24 PM UTC
Pinout / Pin List Click Here (Member Only)

BTS134D Details

Manufacturer Part Number:
BTS134D
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-252
Package Description:
GREEN, PLASTIC, TO-252, 3 PIN
Pin Count:
4
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Factory Lead Time:
8 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
14
Built-in Protections:
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits:
1
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Length:
6.5 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
2
Output Current Flow Direction:
SINK
Output Current-Max:
3 A
Output Peak Current Limit-Nom:
24 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
TO-252
Package Equivalence Code:
SIP3,.1TB
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
2.5 mm
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Technology:
MOS
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
2.28 mm
Terminal Position:
SINGLE
Turn-off Time:
100 µs
Turn-on Time:
100 µs
Width:
6.22 mm

BTS134D Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. Ensure good thermal conductivity by using thermal vias and a solid copper pour on the bottom layer.
Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Also, follow the recommended operating temperature range and derating guidelines.
Use a shielded cable or a twisted pair for the output stage, and ensure proper grounding and decoupling. Implement a common-mode choke or a ferrite bead to reduce EMI emissions. Follow the recommended PCB layout and component placement guidelines.
Choose the optimal output stage configuration (e.g., half-bridge or full-bridge) based on the application requirements. Ensure proper dead-time control, and consider using a synchronous rectification scheme to reduce losses.
Use a high-precision oscilloscope and a current probe to measure the output voltage and current. Ensure proper probe placement and compensation to minimize measurement errors. Follow the recommended test setup and procedure outlined in the application notes.

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BTS134D Overview

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