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BU2006-E3/45 - Vishay

Description: Vishay BU2006-E3/45, Bridge Rectifier, 20A 600V, 4-Pin BU

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Symbol
BU2006-E3/45 - Vishay - PCB symbol
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PCB Footprints
BU2006-E3/45 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - Case Type BU
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3D Models
BU2006-E3/45 - Vishay - 3D model - Transistor Outline, Vertical - Case Type BU
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BU2006-E3/45 Details

  • Manufacturer Part Number:

    BU2006-E3/45

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE BU, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.85

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

BU2006-E3/45 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BU2006-E3/45 is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • While the BU2006-E3/45 has a maximum operating temperature of 150°C, it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for derating curves and consult with a thermal expert if necessary.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a soldering flux to the pads. Use a solder with a melting point of 180°C to 220°C, and avoid applying excessive force or pressure during soldering.
  • Store the BU2006-E3/45 in a dry, cool place with a relative humidity of 50% or less, and avoid exposing it to direct sunlight, moisture, or extreme temperatures.
  • While the BU2006-E3/45 is designed to withstand normal vibrations, it's recommended to consult with a mechanical engineer to ensure the device can withstand the specific vibration levels and frequencies in your application.

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BU2006-E3/45 Overview

Use the download button to access the BU2006-E3/45 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BU200, or try a keyword search, such as Bridge Rectifier Diodes

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