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BU7442FVM-TR - ROHM Semiconductor

Description: Low Power Ground Sense Operational Amplifier

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BU7442FVM-TR - ROHM Semiconductor  - 3D model
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BU7442FVM-TR Details

  • Manufacturer Part Number:

    BU7442FVM-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.2

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    0.48 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    600

  • Voltage Gain-Min:

    3160

  • Width:

    2.8 mm

BU7442FVM-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure stable operation, ROHM recommends using an output capacitor with a low ESR (Equivalent Series Resistance) and a capacitance value between 10uF to 100uF. Additionally, a 1uF to 10uF ceramic capacitor in parallel with the output capacitor can help improve stability.
  • The maximum allowed voltage on the EN (Enable) pin is 6V. Exceeding this voltage may damage the device.
  • The BU7442FVM-TR is rated for operation up to 105°C. However, the device's performance and reliability may degrade at high temperatures. ROHM recommends derating the output current and voltage according to the temperature derating curve in the datasheet.
  • The power dissipation of the BU7442FVM-TR can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.

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BU7442FVM-TR Overview

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