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BZX384-B3V3,115 - Nexperia

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BZX384-B3V3,115 - Nexperia  - 3D model
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BZX384-B3V3,115 Details

  • Manufacturer Part Number:

    BZX384-B3V3,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-76, SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX384-B3V3,115 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX384-B3V3,115 is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask opening of 0.5 mm x 0.2 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations for BZX384-B3V3,115, ensure good thermal conduction by using a thermal via or a thermal pad on the PCB. Keep the component away from heat sources and ensure good airflow around the component. Also, consider using a heat sink or a thermal interface material (TIM) if the application requires high power dissipation.
  • The maximum allowable voltage for BZX384-B3V3,115 is 3.6 V, which is the maximum rated voltage specified in the datasheet. Exceeding this voltage may damage the component or affect its reliability.
  • Yes, BZX384-B3V3,115 can be used in high-frequency applications up to 100 MHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance. Ensure proper PCB layout and decoupling to minimize these effects.
  • To ensure the reliability of BZX384-B3V3,115 in a harsh environment, follow proper PCB design and assembly guidelines, and ensure the component is operated within its specified ratings. Also, consider using conformal coating, potting, or encapsulation to protect the component from moisture, vibration, and other environmental stresses.

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BZX384-B3V3,115 Overview

Use the download button to access the BZX384-B3V3,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX38, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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