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BZX79-B33,113 - Nexperia

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BZX79-B33,113 - Nexperia  - 3D model
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BZX79-B33,113 Details

  • Manufacturer Part Number:

    BZX79-B33,113

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    AXIAL

  • Package Description:

    SC-40, SOD-27, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD27

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.93

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JEDEC-95 Code:

    DO-35

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    325 Ω

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    23.1 V

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    33.4 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    2 mA

BZX79-B33,113 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX79-B33,113 can be found in the Nexperia's SOD323 package outline drawing, which is available on the Nexperia website. The land pattern should ensure a good thermal connection to the PCB to dissipate heat efficiently.
  • BZX79-B33,113 is an ESD-sensitive device. To handle ESD sensitivity, follow proper ESD handling procedures during assembly, storage, and shipping. Use ESD-protective packaging, wrist straps, and mats, and ensure that the device is not exposed to static electricity.
  • The maximum allowable power dissipation for BZX79-B33,113 depends on the ambient temperature and the thermal resistance of the PCB. As a general rule, the maximum power dissipation is 500 mW at an ambient temperature of 25°C. However, this value can be derated based on the actual operating conditions.
  • Yes, BZX79-B33,113 is suitable for high-reliability applications. Nexperia provides a range of reliability data, including FIT rates and MTBF, which can be used to assess the device's suitability for high-reliability applications.
  • To ensure the long-term stability of the voltage regulator output, follow proper design and layout guidelines, including minimizing noise and ripple on the input voltage, using a stable input voltage, and ensuring a good thermal connection to the PCB.

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BZX79-B33,113 Overview

Use the download button to access the BZX79-B33,113 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image 933166990133 Nexperia

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Part Image BZX79-B33 NXP Semiconductors

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Part Image BZX79-B33 General Instrument Corp

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