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BZX84-B22,215 - Nexperia

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BZX84-B22,215 - Nexperia  - 3D model
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BZX84-B22,215 Details

  • Manufacturer Part Number:

    BZX84-B22,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1999-05-18

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    55 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    250 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    22 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    15.4 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    20 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

BZX84-B22,215 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84-B22,215 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.2 mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a large copper area on the PCB. The thermal resistance of the device is 300 K/W, and the maximum junction temperature is 150°C.
  • The derating curve for the BZX84-B22,215 is not explicitly provided in the datasheet, but it can be estimated based on the maximum power dissipation of 500 mW and the thermal resistance of 300 K/W.
  • Yes, the BZX84-B22,215 is suitable for high-reliability applications, as it is manufactured using a high-reliability process and is qualified according to AEC-Q101.
  • To ensure proper soldering, use a soldering profile with a peak temperature of 260°C, and a soldering time of 10-30 seconds. The device is also sensitive to moisture, so ensure proper handling and storage.

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BZX84-B22,215 Overview

Use the download button to access the BZX84-B22,215 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX84, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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