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BZX84-B39,215 - Nexperia

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BZX84-B39,215 - Nexperia  - 3D model
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BZX84-B39,215 Details

  • Manufacturer Part Number:

    BZX84-B39,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1999-05-18

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    130 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    350 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    39 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    27.3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    41.2 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    2 mA

BZX84-B39,215 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BZX84-B39,215 is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a solder mask opening of 0.6 mm x 0.8 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The BZX84-B39,215 has a thermal resistance of 300 K/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. Also, ensure good airflow around the component to prevent overheating.
  • The recommended soldering profile for the BZX84-B39,215 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the BZX84-B39,215 is suitable for high-reliability applications. It is manufactured using a high-reliability process and has undergone rigorous testing to ensure its performance and reliability. However, it is essential to follow proper design, manufacturing, and testing procedures to ensure the component's reliability.
  • To ensure the BZX84-B39,215 is properly biased, ensure that the voltage across the component is within the recommended operating range of 39 V. Also, ensure that the component is connected in the correct polarity, with the anode connected to the positive voltage and the cathode connected to the negative voltage or ground.

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BZX84-B39,215 Overview

Use the download button to access the BZX84-B39,215 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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