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BZX84C27 - onsemi

Description: BZX84C27, Zener Diode, 27V ±5 350 mW 0.05µA, 3-Pin SOT-23

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PCB Footprints
BZX84C27 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CASE 318−08
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3D Models
BZX84C27 - onsemi  - 3D model - SOT23 (3-Pin) - CASE 318−08
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BZX84C27 Details

  • Manufacturer Part Number:

    BZX84C27

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318BM

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    45 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    300 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    27 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    18.9 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    25.3 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX84C27 Frequently Asked Questions (FAQs)

  • The recommended footprint for the BZX84C27 is a standard SOD123 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm.
  • The BZX84C27 is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures. Consult the datasheet for thermal derating information.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder to the pads. Avoid applying excessive heat or force, which can damage the device.
  • The typical leakage current of the BZX84C27 is less than 0.1 μA at 25°C, but this can vary depending on the specific device and operating conditions.
  • While the BZX84C27 can be used as a voltage regulator, it's not recommended due to its limited power handling capability and potential for thermal runaway. Instead, consider using a dedicated voltage regulator IC.

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BZX84C27 Overview

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Part Image BZX84C27TA Zetex / Diodes Inc

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Part Image BZX84C27 NXP Semiconductors

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Part Image BZX84-C27/T3 NXP Semiconductors

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For a full list of alternate parts for BZX84C27, check out Findchips.com