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BZX884-C18,315 - Nexperia

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BZX884-C18,315 Details

  • Manufacturer Part Number:

    BZX884-C18,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, DFN1006-2, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    45 Ω

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    225 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    12.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    14.4 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

BZX884-C18,315 Frequently Asked Questions (FAQs)

  • The recommended land pattern for BZX884-C18,315 can be found in the Nexperia's SOT23 package outline document, which provides detailed information on the recommended pad layout and dimensions for optimal soldering and thermal performance.
  • To prevent ESD damage, it is recommended to handle BZX884-C18,315 devices with ESD-protective equipment, such as wrist straps, mats, and bags. Additionally, ensure that the device is stored in a conductive bag or container when not in use.
  • The maximum power dissipation of BZX884-C18,315 is dependent on the ambient temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 250 mW at an ambient temperature of 25°C. However, this value can be derated based on the actual operating conditions.
  • BZX884-C18,315 is rated for operation up to 150°C, but the device's performance and reliability may be affected at high temperatures. It is recommended to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure the reliability of BZX884-C18,315 in a humid environment, it is recommended to follow proper storage and handling procedures, such as storing the devices in a dry, nitrogen-filled environment, and using moisture-barrier bags or containers. Additionally, consider using conformal coating or potting compounds to protect the device from moisture.

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BZX884-C18,315 Overview

Use the download button to access the BZX884-C18,315 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BZX88, or try a keyword search, such as Zener Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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