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CAT34TS02VP2GT4C - onsemi

Description: JEDEC JC42.4 Compliant Temperature Sensor; Temperature Range: -20°C to 125°C; DDR3 DIMM compliant SPD EEPROM; Supply Range: 3.3 V 10%; I2C /SMBus Interface; Schmitt triggers and noise suppression filters on SCL and SDA inputs; Low power CMOS technology; 2 x 3 x 0.75 mm TDFN Package; These Devices are Pb-Free and are RoHS Compliant

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CAT34TS02VP2GT4C Details

  • Manufacturer Part Number:

    CAT34TS02VP2GT4C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN8, 2x3

  • Package Description:

    3 X 2 MM, 0.75 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, MO-229, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    511AK

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Body Breadth:

    2 mm

  • Body Height:

    0.75 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.5 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Termination Type:

    SOLDER

CAT34TS02VP2GT4C Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
  • Ensure that the device is operated within the recommended voltage and current specifications. Also, consider the thermal derating of the device and ensure that the junction temperature (Tj) does not exceed 150°C. Proper PCB design and thermal management are crucial for reliable operation.
  • Onsemi recommends using a human body model (HBM) ESD protection circuit at the input pins to prevent damage from electrostatic discharge. A minimum of 2kV HBM ESD protection is recommended.
  • The power-up and power-down sequencing of the device should be controlled to prevent unwanted voltage conditions. A soft-start circuit can be used to control the power-up sequence. Ensure that the input voltage (VIN) is stable before enabling the output voltage (VOUT).
  • Onsemi recommends using a minimum of 10uF ceramic capacitor at the input (VIN) and a minimum of 22uF ceramic capacitor at the output (VOUT). The capacitor values may need to be adjusted based on the specific application requirements.

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CAT34TS02VP2GT4C Overview

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