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CM2020-01TR - onsemi

Description: Obsolete - HDMI Receiver Port Protection and Interface Device

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CM2020-01TR - onsemi - PCB symbol
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PCB Footprints
CM2020-01TR - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP38 CASE 948AG-01
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3D Models
CM2020-01TR - onsemi - 3D model - Small Outline Packages - TSSOP38 CASE 948AG-01
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CM2020-01TR Details

  • Manufacturer Part Number:

    CM2020-01TR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP 38

  • Package Description:

    TSSOP-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    948AG

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.13 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

CM2020-01TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 20-30 seconds. Ensure a soldering iron temperature of 350°C to 370°C for hand soldering.
  • Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Ground all equipment and personnel to prevent static buildup. Avoid touching the device's pins or leads.
  • Store the device in its original packaging, away from direct sunlight, moisture, and extreme temperatures (–40°C to 125°C). Handle the device in a clean, dry environment, and avoid bending or flexing the leads.

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CM2020-01TR Overview

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