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COM20022I-HT - Microchip

Description: Network Controller & Processor ICs ARCNET Contrllr

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COM20022I-HT Details

  • Manufacturer Part Number:

    COM20022I-HT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TQFP-48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Bus Compatibility:

    8051; 6801

  • Clock Frequency-Max:

    20 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    1.25 MBps

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Low Power Mode:

    NO

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    48

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    2048

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, LAN

COM20022I-HT Frequently Asked Questions (FAQs)

  • A good PCB layout for the COM20022I-HT involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliable operation of the COM20022I-HT in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • When selecting capacitors for the COM20022I-HT, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a voltage rating that exceeds the maximum voltage of the device, and select capacitors with low ESR to minimize power loss.
  • To troubleshoot issues with the COM20022I-HT, start by reviewing the device's datasheet and application notes. Check the power supply voltage, clock frequency, and signal integrity. Use oscilloscopes or logic analyzers to debug the issue, and consult Microchip's technical support resources if needed.
  • When using the COM20022I-HT in a system with multiple power domains, ensure that the device is properly powered down or isolated during power domain transitions. Use level shifters or voltage translators as needed to ensure signal integrity, and consider using power domain controllers to manage power sequencing.

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COM20022I-HT Overview

Use the download button to access the COM20022I-HT 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like COM20, or try a keyword search, such as Serial IO/Communication Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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