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CR01005-FW-2201GLF - Bourns

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CR01005-FW-2201GLF Details

  • Manufacturer Part Number:

    CR01005-FW-2201GLF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.13 mm

  • Package Length:

    0.4 mm

  • Package Style:

    SMT

  • Package Width:

    0.2 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.0313 W

  • Rated Temperature:

    70 °C

  • Resistance:

    2200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    01005

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    15 V

CR01005-FW-2201GLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CR01005-FW-2201GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While the CR01005-FW-2201GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
  • To prevent damage, handle the CR01005-FW-2201GLF by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats. During PCB assembly, ensure that the component is properly aligned and seated on the PCB to prevent mechanical stress.
  • The recommended soldering profile for CR01005-FW-2201GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • While the CR01005-FW-2201GLF is designed to be moisture-resistant, it's essential to consider the application's environmental conditions. If the component will be exposed to high humidity or moisture, additional protection measures such as conformal coating or hermetic sealing may be necessary.

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CR01005-FW-2201GLF Overview

Use the download button to access the CR01005-FW-2201GLF 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like CR010, or try a keyword search, such as Metal Glaze/Thick Film Resistors

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