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CSD18503KCS - Texas Instruments

Description: MOSFET 40V N-Ch NexFET Power MOSFET

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CSD18503KCS - Texas Instruments PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - KCS (R-PSFM-T3)_1
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CSD18503KCS - Texas Instruments  - 3D model - Transistor Outline, Vertical - KCS (R-PSFM-T3)_1
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CSD18503KCS Details

  • Manufacturer Part Number:

    CSD18503KCS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    162 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    142 A

  • Drain-source On Resistance-Max:

    0.0068 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    16 pF

  • JEDEC-95 Code:

    TO-220

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    143 W

  • Pulsed Drain Current-Max (IDM):

    358 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD18503KCS Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the CSD18503KCS is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Typically, this involves connecting the gate-source voltage (VGS) to a suitable voltage source, and ensuring the drain-source voltage (VDS) is within the recommended range.
  • For optimal thermal management, it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing thermal resistance, and ensuring adequate heat sinking. Texas Instruments provides a thermal design guide and PCB layout recommendations in the datasheet and application notes.
  • To protect the device from overvoltage and overcurrent conditions, use suitable protection circuits, such as voltage clamps, current limiters, and overvoltage protection (OVP) circuits. Additionally, ensure that the device is operated within its recommended safe operating area (SOA).
  • When paralleling multiple CSD18503KCS devices, ensure that each device is properly biased and matched, and that the gate-source voltage is synchronized. Additionally, consider the impact of device mismatch, thermal management, and PCB layout on overall system performance.

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CSD18503KCS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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