CY7C1370KV33-167AXI - Infineon

CY7C1370KV33-167AXI Details

• Manufacturer Part Number:

  CY7C1370KV33-167AXI

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TQFP-100

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  6

• Access Time-Max:

  3.4 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• JESD-30 Code:

  R-PQFP-G100

• JESD-609 Code:

  e3

• Length:

  20 mm

• Memory Density:

  18874368 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  100

• Number of Words:

  524288 words

• Number of Words Code:

  512000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512KX36

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LQFP

• Package Shape:

  RECTANGULAR

• Package Style:

  FLATPACK, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.6 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  3.135 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Pure Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Width:

  14 mm