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DA14691-00000HQ2 - Renesas Electronics

Description: The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions is a feature-rich range of multi-core microcontroller units for wireless connectivity.The product family builds off the successes of Renesas' SmartBond line, boasting three additional cores that offer greater processing power, resources, range, and battery life, enabling developers to push the boundaries of a wide array of connected consumer applications. The DA1469x line provides developers with advanced connectivity features to future-proof

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DA14691-00000HQ2 - Renesas Electronics PCB footprint - BGA - BGA - VFBGA86
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DA14691-00000HQ2 - Renesas Electronics  - 3D model - BGA - VFBGA86
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DA14691-00000HQ2 Details

  • Manufacturer Part Number:

    DA14691-00000HQ2

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-86

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    9

  • Additional Feature:

    100/1000 (samples) AVAILABLE

  • JESD-30 Code:

    S-PBGA-B86

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    86

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA86,10X10,22

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.92 mm

  • Supply Voltage-Max:

    4.75 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.55 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

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DA14691-00000HQ2 Overview

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