Description:The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions is a feature-rich range of multi-core microcontroller units for wireless connectivity.The product family builds off the successes of Renesas' SmartBond line, boasting three additional cores that offer greater processing power, resources, range, and battery life, enabling developers to push the boundaries of a wide array of connected consumer applications. The DA1469x line provides developers with advanced connectivity features to future-proof
Renesas provides a recommended PCB layout guide in the DA14697-00000HR2 application note (Document Number: DA14697-00000HR2-AN-001) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The DA14697-00000HR2 has a built-in Secure Boot mechanism that ensures the authenticity and integrity of the firmware. Renesas provides a Secure Boot guide (Document Number: DA14697-00000HR2-SB-001) that explains how to implement secure boot and firmware updates using the DA14697-00000HR2's cryptographic accelerators and secure storage.
The DA14697-00000HR2 is rated for operation from -40°C to +85°C, but it's recommended to operate within the -20°C to +70°C range for optimal performance and reliability. For more information, refer to the DA14697-00000HR2 datasheet, Section 4.1: Operating Conditions.
The DA14697-00000HR2 has various power-saving features, such as dynamic voltage and frequency scaling, sleep modes, and power gating. Renesas provides a Power Management guide (Document Number: DA14697-00000HR2-PM-001) that explains how to optimize power consumption for battery-powered applications using these features.
Renesas recommends using a 32.768 kHz crystal oscillator with a load capacitance of 10 pF to 20 pF for optimal performance and stability. For more information, refer to the DA14697-00000HR2 datasheet, Section 5.3: Crystal Oscillator.
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DA14697-00000HR2 Overview
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