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DF005M - onsemi

Description: Lifetime - 1.5A Bridge Rectifier

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PCB Footprints
DF005M - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 4-lead,DIP ,6.5 MM WIDE
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3D Models
DF005M - onsemi  - 3D model - Dual-In-Line Packages - 4-lead,DIP ,6.5 MM WIDE
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DF005M Details

  • Manufacturer Part Number:

    DF005M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP-4

  • Package Description:

    DIP-4

  • Manufacturer Package Code:

    646CL

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDIP-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Power Dissipation-Max:

    3.1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

DF005M Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device within its operating temperature range.
  • The recommended soldering conditions for the DF005M are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the devices by the body or pins, avoid touching the pins or die, and store the devices in an ESD-protective package or bag.
  • The recommended storage conditions for the DF005M are a temperature range of -40°C to 125°C, a humidity level of 60% or less, and storage in an ESD-protective package or bag.

Trust Checks

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DF005M Overview

Use the download button to access the DF005M schematic symbol, PCB footprint, and 3D model.
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