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DS1110LE-200+ - Analog Devices

Description: Delay Lines / Timing Elements 3V 10-Tap Silicon Delay Line

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DS1110LE-200+ - Analog Devices - PCB symbol
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DS1110LE-200+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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DS1110LE-200+ - Analog Devices - 3D model - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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DS1110LE-200+ Details

  • Manufacturer Part Number:

    DS1110LE-200+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Package Description:

    0.173 INCH, LOW PROFILE, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-05-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Family:

    1110

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    SILICON DELAY LINE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Taps/Steps:

    10

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance-Nom (Z0):

    50 Ω

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    150 mA

  • Programmable Delay Line:

    NO

  • Prop. Delay@Nom-Sup:

    13 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Delay-Nom (td):

    200 ns

  • Width:

    4.4 mm

DS1110LE-200+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS1110LE-200+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the input and output stages. A 4-layer PCB with a dedicated analog ground layer is recommended.
  • To ensure accurate temperature measurement, it's essential to follow proper thermal design practices, such as using a thermally conductive material for the PCB, minimizing thermal gradients, and calibrating the device. Additionally, the device should be mounted in a way that minimizes thermal resistance between the device and the measured object.
  • The maximum cable length for the DS1110LE-200+ depends on the specific application and the type of cable used. As a general rule, a cable length of up to 10 meters is recommended for optimal performance. However, if a longer cable is required, it's essential to use a shielded cable and follow proper termination and impedance matching techniques to minimize signal degradation.
  • Yes, the DS1110LE-200+ is designed to operate in high-vibration environments. However, it's essential to follow proper mounting and packaging techniques to ensure the device is securely attached to the PCB and the PCB is properly secured to the system. Additionally, the device should be calibrated and tested in the specific vibration environment to ensure accurate performance.
  • Common issues with the DS1110LE-200+ include incorrect temperature readings, noise, and oscillations. To troubleshoot these issues, start by checking the PCB layout, ensuring proper grounding and decoupling, and verifying the power supply voltage. Additionally, check for any signs of physical damage or contamination on the device or PCB.

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DS1110LE-200+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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