DS1250Y-70IND+ footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

DS1250Y-70IND+ - Analog Devices PCB footprint - Dual-In-Line Sockets - Dual-In-Line Sockets - EDIP_32

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Datasheet Download Datasheet
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Part Number DS1250Y-70IND+
Manufacturer Analog Devices
Pin Count 32
Part Category Integrated Circuit
Package Category Dual-In-Line Sockets
Footprint Name Dual-In-Line Sockets - EDIP_32
Released Date Jan 10, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

DS1250Y-70IND+ Details

Manufacturer Part Number:
DS1250Y-70IND+
Brand Name:
Analog Devices Inc
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
N/A
Pin Count:
32
Manufacturer Package Code:
N/A
Country Of Origin:
Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA
ECCN Code:
3A991.b.2.a
HTS Code:
8542.32.00.41
Date Of Intro:
2002-10-30
Manufacturer:
Analog Devices Inc
YTEOL:
8.5
Access Time-Max:
70 ns
Additional Feature:
10 YEAR DATA RETENTION
JESD-30 Code:
R-XDMA-P32
JESD-609 Code:
e3
Memory Density:
4194304 bit
Memory IC Type:
NON-VOLATILE SRAM MODULE
Memory Width:
8
Number of Functions:
1
Number of Terminals:
32
Number of Words:
524288 words
Number of Words Code:
512000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
512KX8
Package Body Material:
UNSPECIFIED
Package Code:
DIP
Package Equivalence Code:
DIP32,.6
Package Shape:
RECTANGULAR
Package Style:
MICROELECTRONIC ASSEMBLY
Parallel/Serial:
PARALLEL
Qualification Status:
Not Qualified
Standby Current-Max:
0.0006 A
Supply Current-Max:
0.085 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
NO
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
PIN/PEG
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL

DS1250Y-70IND+ Frequently Asked Questions (FAQs)

A good PCB layout for the DS1250Y-70IND+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the input and output stages. A 4-layer PCB with a dedicated power plane and a separate analog ground plane is recommended.
To ensure the DS1250Y-70IND+ operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and keep the device away from high-temperature sources. Also, consider using a thermal interface material between the device and the heat sink to improve heat transfer.
Not using the recommended bypass capacitors for the DS1250Y-70IND+ can lead to instability, oscillations, and reduced performance. The bypass capacitors help to filter out noise and provide a stable power supply to the device. Omitting them can result in reduced accuracy, increased noise, and potential device failure.
While the DS1250Y-70IND+ is specified for industrial temperature range (-40°C to 85°C), it can be used in non-industrial temperature range applications with some caveats. However, the device's performance and accuracy may be affected, and the manufacturer's warranty may not apply. Consult with Analog Devices Inc for specific guidance.
To troubleshoot issues with the DS1250Y-70IND+, start by verifying the power supply and clock signals, then check the input and output signals using an oscilloscope. Consult the datasheet and application notes for guidance on specific troubleshooting techniques and potential error sources.

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DS1250Y-70IND+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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