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DS1390U-33+T&R - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - DS1390U-33+T&R - Alarm RTC IC, Date Time Format (Day/Date/Month/Year hh:mm:ss:hh), SPI, 2.97 V to 5.5 V, µSOP-10

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DS1390U-33+T&R - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 10 µSOP
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DS1390U-33+T&R - Analog Devices  - 3D model - Small Outline Packages - 10 µSOP
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DS1390U-33+T&R Details

  • Manufacturer Part Number:

    DS1390U-33+T&R

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    10-MINI_SO-N/A

  • Package Description:

    TSSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2004-07-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Clock Frequency-Max:

    0.032 MHz

  • Information Access Method:

    SERIAL(SPI), SERIAL, 3-WIRE

  • Interrupt Capability:

    Y

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time-Min:

    1/100 SECOND

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Volatile:

    NO

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    TIMER, REAL TIME CLOCK

DS1390U-33+T&R Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS1390U-33+T&R involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling, connect the VCC pin to a clean, low-noise power supply, and use a 0.1uF ceramic capacitor between VCC and GND as close to the device as possible. Additionally, consider adding a 10uF bulk capacitor in parallel to further reduce noise and ripple.
  • The maximum clock frequency for the DS1390U-33+T&R is 33MHz, as specified in the datasheet. However, it's recommended to derate the clock frequency by 10-20% to ensure reliable operation and minimize jitter.
  • The DS1390U-33+T&R has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within a safe operating temperature range by providing adequate heat sinking, using a thermal pad or heat sink, and ensuring good airflow around the device.
  • The DS1390U-33+T&R has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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DS1390U-33+T&R Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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