HIGH RELIABILITY, LOW NOISE, FREE WHEELING DIODE, SNUBBER DIODE
Application:
FAST RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.4 V
JEDEC-95 Code:
TO-247AD
JESD-30 Code:
R-PSFM-T2
Non-rep Pk Forward Current-Max:
300 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
37 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Dissipation-Max:
125 W
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
600 V
Reverse Recovery Time-Max:
0.035 µs
Surface Mount:
NO
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
DSEI30-06A Frequently Asked Questions (FAQs)
The recommended PCB footprint for the DSEI30-06A is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a minimum of 0.5mm clearance around the component body.
To ensure reliable soldering of the DSEI30-06A, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component, and avoid applying excessive force or pressure during the soldering process.
The maximum operating temperature range for the DSEI30-06A is -40°C to 125°C. However, the device can withstand short-term excursions up to 150°C without damage.
Yes, the DSEI30-06A is designed for high-reliability applications and meets the requirements of various industry standards, including AEC-Q101 and IEC 60747-5-5. However, it is essential to follow proper design, manufacturing, and testing procedures to ensure the device meets the required reliability standards.
Handle the DSEI30-06A by the body, avoiding touching the leads or electrical contacts. Store the device in its original packaging or a similar protective container, away from direct sunlight, moisture, and extreme temperatures. Avoid bending or flexing the leads, and do not stack components on top of each other.
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DSEI30-06A Overview
Use the download button to access the DSEI30-06A schematic symbol, PCB footprint, and 3D model.
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