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DSEI30-12A - LITTELFUSE

Description: IXYS DSEI30-12A, Switching Diode, 1200V 26A, 60ns, 2-Pin TO-247AD

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Symbol
DSEI30-12A - LITTELFUSE - PCB symbol
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PCB Footprints
DSEI30-12A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-AD_3
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3D Models
DSEI30-12A - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247-AD_3
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DSEI30-12A Details

  • Manufacturer Part Number:

    DSEI30-12A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.95

  • Additional Feature:

    HIGH RELIABILITY, LOW NOISE, FREEWHEELING, SNUBBER DIODE

  • Application:

    FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    26 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    138 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Recovery Time-Max:

    0.04 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

DSEI30-12A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DSEI30-12A is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a minimum of 0.5mm clearance around the perimeter.
  • To ensure reliable soldering of the DSEI30-12A, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the DSEI30-12A is -40°C to 150°C. However, the device can withstand storage temperatures up to 200°C for short periods of time.
  • Yes, the DSEI30-12A is designed for high-reliability applications and meets the requirements of various industry standards, including AEC-Q101 and IEC 60747-5-5.
  • Handle the DSEI30-12A by the body of the component, avoiding touching the leads or the glass passivation. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.

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DSEI30-12A Overview

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