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DSP25-12A - LITTELFUSE

Description: Rectifiers 1200V 2X28A

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PCB Footprints
DSP25-12A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-AD
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3D Models
DSP25-12A - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247-AD
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DSP25-12A Details

  • Manufacturer Part Number:

    DSP25-12A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, TO-247AD, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.95

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    180 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    28 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    2000 µA

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DSP25-12A Frequently Asked Questions (FAQs)

  • A good PCB layout for the DSP25-12A involves keeping the leads as short as possible, using a solid ground plane, and minimizing the distance between the device and the circuit's return path. Additionally, it's recommended to use a common ground point for all components and to avoid routing high-frequency signals near the device.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the DSP25-12A on the pads. Use a gentle touch to avoid applying excessive pressure, which can damage the device. Finally, inspect the solder joints for any defects or cold solder joints.
  • The DSP25-12A has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • Yes, the DSP25-12A is suitable for high-reliability applications. Littelfuse Inc. provides a range of reliability data, including FIT rates and MTBF, to support the use of the DSP25-12A in critical applications. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the device meets the required reliability standards.
  • To troubleshoot issues with the DSP25-12A, start by verifying the device's pinout and ensuring that the voltage and current ratings are not exceeded. Check for any signs of physical damage, such as cracks or corrosion. Use a multimeter to measure the device's resistance and voltage drops. If the issue persists, consult the datasheet and application notes or contact Littelfuse Inc.'s technical support.

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