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EC103DAP - LITTELFUSE

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EC103DAP - LITTELFUSE  - 3D model
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EC103DAP Details

  • Manufacturer Part Number:

    EC103DAP

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    CYLINDRICAL, O-PBCY-T3

  • Pin Count:

    3

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    30 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    5 mA

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.1 mA

  • Moisture Sensitivity Level:

    2

  • Non-Repetitive Pk On-state Cur:

    20 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.8 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

EC103DAP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a thermal pad with a minimum size of 100mm² and a thickness of 1.5mm to ensure good thermal conductivity. Additionally, a thermal via array with a minimum of 10 vias, 0.5mm in diameter, and spaced 1.5mm apart is recommended to dissipate heat efficiently.
  • Littelfuse recommends using a soldering iron with a temperature of 260°C to 280°C and a solder with a melting point of 217°C to 221°C. The component should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
  • The EC103DAP has a maximum surge current rating of 100A for 10ms, as per the IEC 61000-4-5 standard. However, it's essential to consult the datasheet and application notes for specific surge current requirements and derating factors.
  • While the EC103DAP is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100kHz. However, the device's impedance and insertion loss should be carefully evaluated, and the application notes should be consulted for specific guidance.
  • Littelfuse recommends using a fuse holder or clip that meets the IEC 60127-6 standard. The fuse holder or clip should be designed for the specific fuse size and type, and it should provide a secure and reliable connection to the PCB.

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EC103DAP Overview

Use the download button to access the EC103DAP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like EC103, or try a keyword search, such as Silicon Controlled Rectifiers

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For a full list of alternate parts for EC103DAP, check out Findchips.com