Part Image

ECH8501-TL-H - onsemi

Description: Bipolar Transistor, (-)30V, (-)30A, Low VCE(sat), Complementary Dual

Download ECH8501-TL-H Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
ECH8501-TL-H - onsemi  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

ECH8501-TL-H Details

  • Manufacturer Part Number:

    ECH8501-TL-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-28FL / ECH8

  • Pin Count:

    8

  • Manufacturer Package Code:

    318BF

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    5 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    280 MHz

ECH8501-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Yes, the ECH8501-TL-H is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure compliance with specific industry standards and regulations, such as ISO 26262 for automotive functional safety.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical connections. Use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

ECH8501-TL-H Overview

Use the download button to access the ECH8501-TL-H 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like ECH85, or try a keyword search, such as Power Bipolar Transistors

Parts related to ECH8501-TL-H

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview