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EGF1B - onsemi

Description: Low forward voltage drop. ; Low profile package. ; Fast switching for high efficiency.

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PCB Footprints
EGF1B - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA
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EGF1B - onsemi  - 3D model - Diodes Moulded - SMA
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EGF1B Details

  • Manufacturer Part Number:

    EGF1B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

EGF1B Frequently Asked Questions (FAQs)

  • A good PCB layout for EGF1B involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a shielded enclosure to reduce EMI.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, and adjust the bias resistors to achieve the desired output voltage. Also, ensure the input voltage is within the recommended range.
  • The maximum power dissipation of EGF1B is typically around 1.5W. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and keep the ambient temperature within the recommended range.
  • Yes, EGF1B can be used in switching power supply applications, but it's essential to ensure the device is properly biased and the input voltage is within the recommended range. Additionally, consider the device's power handling capabilities and thermal management.
  • To troubleshoot issues with EGF1B, start by checking the biasing circuit, ensuring the input voltage is within the recommended range, and verifying the PCB layout is correct. If issues persist, consult the datasheet and application notes for guidance.

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EGF1B Overview

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Part Image EGF1B General Instrument Corp

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