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EN2342QI - Intel

Description: IC REG BUCK ADJ 4A SYNC 68QFN

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PCB Footprints
EN2342QI - Intel PCB footprint - Other - Other - EN2342QI-3
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3D Models
EN2342QI - Intel  - 3D model - Other - EN2342QI-3
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EN2342QI Details

  • Manufacturer Part Number:

    EN2342QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    8 X 11 MM, 3 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, QFN-68

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    ADJUSTABLE OUTPUT MODE FROM 0.75 TO 5 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N68

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    68

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    0.75 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC68,.31X.43,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.05 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    8 mm

EN2342QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Refer to Intel's application note AN-1011 for more details.
  • Implement thermal management techniques such as heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the specified temperature range (0°C to 70°C).
  • Use shielding, filtering, and grounding techniques to minimize EMI and RFI. Ensure the device is placed in a shielded enclosure, and use EMI filters on I/O lines. Refer to Intel's application note AN-1012 for more information.
  • Use Intel's debugging tools and software, such as the Intel System Debugger and the Intel System Studio. Consult the device's datasheet and application notes for troubleshooting guidelines.
  • The device requires a specific power-up sequence to ensure proper operation. Refer to the datasheet for the recommended power-up sequence and voltage requirements.

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EN2342QI Overview

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