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EN6363QI - Intel

Description: Switching Voltage Regulators 6A Ultra Small PowerSoC DC-DC Step-Down Converter

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PCB Footprints
EN6363QI - Intel PCB footprint - Other - Other - EN6363QI-1
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3D Models
EN6363QI - Intel  - 3D model - Other - EN6363QI-1
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EN6363QI Details

  • Manufacturer Part Number:

    EN6363QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6.6 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XQCC-N34

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    34

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    6.12 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC34,.24X.16,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.55 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

EN6363QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the system is designed to operate within the specified temperature range (-40°C to 100°C).
  • The EN6363QI requires a specific power sequencing and voltage regulation scheme to ensure proper operation. Consult the Intel documentation and application notes for detailed guidelines.
  • Implement power gating, dynamic voltage and frequency scaling, and optimize the system's power management scheme to minimize power consumption. Consult the Intel documentation for specific guidelines.
  • Implement a multi-layer PCB with a solid ground plane, use shielding, and follow best practices for signal routing and component placement to minimize EMI and RFI.

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EN6363QI Overview

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