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ENGNTLEF2D2N15GN1TXG - onsemi

Description: Capable of Reverse Conduction; Thermally Enhanced Dual Cooling Package; Optimized for High Frequency Applications (> 500 kHz); No Reverse Recovery Charge; Small RDSon; Ultra Low Gate Charge and Output Charge (Qg, Qd, Qoss)

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ENGNTLEF2D2N15GN1TXG Overview

No models are available for download for ENGNTLEF2D2N15GN1TXG. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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