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EPC1441LC20 - Intel

Description: Configuration Devices for SRAM-Based LUT Devices

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EPC1441LC20 - Intel PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 20-Pin Plastic J-Lead Chip Carrier (PLCC)
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EPC1441LC20 Details

  • Manufacturer Part Number:

    EPC1441LC20

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LCC-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.61

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO REQUIRES 5V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQCC-J20

  • JESD-609 Code:

    e0

  • Length:

    8.9662 mm

  • Memory Density:

    440800 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Words:

    440800 words

  • Number of Words Code:

    440800

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    440800X1

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC20,.4SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Standby Current-Max:

    0.00006 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Width:

    8.9662 mm

EPC1441LC20 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a decoupling capacitor (e.g., 0.1uF) close to the power pin.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.
  • The maximum allowed voltage on the input pins is 3.6V. Exceeding this voltage may damage the device. Use voltage limiting resistors or clamping diodes to prevent overvoltage.
  • Check the power supply voltage and ensure it is within the recommended range. Verify that the input signals are within the specified voltage and frequency ranges. Use an oscilloscope to monitor the signals and check for noise or distortion.
  • No, the EPC1441LC20 is not designed for radiation-hardened applications. It is not tested or guaranteed to operate in high-radiation environments. Use a radiation-hardened equivalent device or consult with Intel Corporation for custom solutions.

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EPC1441LC20 Overview

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Part Image EPC1441LC20N Altera Corporation

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Part Image EPC1441LC20N Intel Corporation

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