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EPC1441TC32N - Intel

Description: EPC1441TC32N, Serial Flash Memory 440800bit, 3 → 3.6 V, 4.5 → 5.5 V, 32-Pin, TQFP

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EPC1441TC32N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
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3D Models
EPC1441TC32N - Intel  - 3D model - Quad Flat Packages - 32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
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EPC1441TC32N Details

  • Manufacturer Part Number:

    EPC1441TC32N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.61

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO REQUIRES 5V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Memory Density:

    440800 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    1

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    440800 words

  • Number of Words Code:

    440800

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    440800X1

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.00006 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

EPC1441TC32N Frequently Asked Questions (FAQs)

  • Intel recommends following the PCB layout guidelines provided in the Intel Cyclone 10 LP FPGA Development Kit User Guide, which includes guidelines for signal integrity, power distribution, and thermal management.
  • Intel recommends following the thermal management guidelines provided in the datasheet, including using a heat sink, ensuring good airflow, and monitoring the device temperature using the built-in thermal diode.
  • Intel recommends consulting the Radiation-Hardened FPGA datasheet and application notes for information on radiation tolerance and mitigation strategies. Additionally, it's essential to follow proper design and testing procedures to ensure the device meets the required radiation standards.
  • Intel provides documentation and support to help customers meet specific industry standards. It's recommended to consult the Intel FPGA Compliance and Certification webpage and contact Intel support for guidance on meeting specific standards.
  • Intel recommends using the Intel FPGA Debug Tools, such as the Signal Tap Logic Analyzer and the Intel FPGA Debugger, to troubleshoot issues. Additionally, consulting the Intel FPGA Knowledge Base and seeking support from Intel's technical support team can be helpful in resolving issues.

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Part Image EPC1441TC32N Altera Corporation

Configuration Memory, 440800X1, CMOS, PQFP32