0.60 X 0.30 MM, HALOGEN FREE AND ROHS COMPLIANT, 567AV, 0201, WLCSP2, 2 PIN
Manufacturer Package Code:
567AV
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Additional Feature:
EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE
Breakdown Voltage-Max:
6.5 V
Breakdown Voltage-Min:
3.68 V
Breakdown Voltage-Nom:
5 V
Clamping Voltage-Max:
6.5 V
Configuration:
SINGLE, 1 CHANNEL
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-XBCC-N2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Polarity:
BIDIRECTIONAL
Reference Standard:
IEC-61000-4-2
Rep Pk Reverse Voltage-Max:
3.3 V
Reverse Current-Max:
0.1 µA
Reverse Test Voltage:
3.3 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
ESD5111FCT5G Frequently Asked Questions (FAQs)
A good PCB layout for ESD5111FCT5G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the connector. A ground plane is also recommended to reduce noise and improve performance.
The recommended capacitor value for ESD5111FCT5G is 1nF to 10nF. The capacitor value should be chosen based on the specific application requirements, such as the frequency of operation and the desired level of ESD protection.
The maximum operating temperature for ESD5111FCT5G is 125°C. However, it's recommended to operate the device within the specified temperature range of -40°C to 85°C for optimal performance and reliability.
Yes, ESD5111FCT5G is suitable for high-speed data lines, such as USB, HDMI, and Ethernet. The device is designed to provide ESD protection while minimizing signal distortion and attenuation.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the device.
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ESD5111FCT5G Overview
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