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FDB047N10 - onsemi

Description: RoHS compliant; High power and current handing capability; Fast switching speed; RDS(on) = 3.9mΩ ( Typ.) @ VGS = 10V, ID = 75A; Low Gate Charge; High performance trench technology for extremely low RDS(on)

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FDB047N10 Details

  • Manufacturer Part Number:

    FDB047N10

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    D3PAK-3/2

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    1153 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0047 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    316 W

  • Pulsed Drain Current-Max (IDM):

    656 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDB047N10 Frequently Asked Questions (FAQs)

  • The maximum junction temperature for the FDB047N10 is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation.
  • To ensure proper biasing, make sure to follow the recommended gate-source voltage (Vgs) and drain-source voltage (Vds) ratings. Typically, Vgs should be between 2-5V, and Vds should be within the specified maximum rating of 100V.
  • For optimal thermal performance, use a PCB with a solid ground plane and a thermal relief pattern under the device. Ensure good thermal conductivity by using thermal vias and a heat sink if necessary. Keep the device away from high-current paths and heat sources.
  • Yes, the FDB047N10 is suitable for high-frequency switching applications up to 1 MHz. However, ensure that the device is properly biased and the PCB layout is optimized for high-frequency operation to minimize losses and ringing.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use ESD-protective packaging and storage materials. Ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays.

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FDB047N10 Overview

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