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FDD5680 - onsemi

Description: Low gate charge (33nC typical); RDS(on) = 25 mΩ @ VGS = 6 V; High performance trench technology for extremely low RDS(on); RDS(on) = 21 mΩ @ VGS = 10 V; 38 A, 60 V; Fast switching speed

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FDD5680 - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD)_2023-1
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FDD5680 Details

  • Manufacturer Part Number:

    FDD5680

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    TO-252, 3 PIN

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    140 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    38 A

  • Drain-source On Resistance-Max:

    0.021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD5680 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDD5680 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To ensure the FDD5680 operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C. Also, ensure the input voltage is within the recommended range of 4.5V to 18V, and the output current is within the recommended range of 0A to 3A.
  • The recommended input capacitor value for the FDD5680 is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor such as X5R or X7R is recommended due to its low equivalent series resistance and high reliability.
  • To troubleshoot the FDD5680, first check the input voltage and ensure it's within the recommended range. Verify the output voltage and current are within the expected range. Check for any signs of overheating, and ensure the device is properly soldered and connected. If issues persist, consult the datasheet and application notes for guidance, or contact onsemi support for further assistance.
  • The FDD5680 is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. If operating in a high-temperature environment, ensure proper thermal management, and consider using a heat sink or thermal interface to keep the junction temperature below 150°C.

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FDD5680 Overview

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