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FDS2734 - onsemi

Description: Fast switching speed ; Max rDS(on) =117mΩ at VGS =10V, ID = 3.0A ; High performance trench technology for extremely low rDS(on) ; Max rDS(on) =126mΩ at VGS = 6V, ID = 2.8A ; High power and current handling capability ; RoHS compliant

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FDS2734 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-1
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FDS2734 - onsemi  - 3D model - Small Outline Packages - SO-8-1
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FDS2734 Details

  • Manufacturer Part Number:

    FDS2734

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SO-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.97

  • Avalanche Energy Rating (Eas):

    12.5 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.225 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

FDS2734 Frequently Asked Questions (FAQs)

  • The maximum current rating of the FDS2734 is 3.5A per channel, but it's recommended to derate the current to 2.5A per channel for reliable operation.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. Also, make sure to decouple the VCC pin with a 0.1uF capacitor to reduce noise.
  • For optimal thermal performance, use a 4-layer PCB with a solid ground plane and a thermal pad connected to the GND pin. Ensure good airflow around the device and consider using a heat sink if operating at high currents.
  • Use a TVS diode or a zener diode to clamp the input voltage to a safe level. Also, consider adding ESD protection devices, such as a transient voltage suppressor (TVS) or a protection array, to protect the device from electrostatic discharge.
  • A bootstrap gate drive circuit is recommended, using a high-voltage capacitor and a low-voltage capacitor to ensure proper gate-source voltage. A dedicated gate driver IC can also be used for more complex designs.

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