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FDS3692 - onsemi

Description: UIS Capability (Single Pulse and Repetitive Pulse); Low QRR Body Diode; Optimized efficiency at high frequencies; Formerly developmental type 82745; Low Miller Charge; Qg(tot) = 11nC (Typ.), VGS = 10V; rDS(ON) = 50mΩ (Typ.), VGS = 10V, ID = 4.5A

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FDS3692 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-1
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FDS3692 - onsemi  - 3D model - Small Outline Packages - SO-8-1
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FDS3692 Details

  • Manufacturer Part Number:

    FDS3692

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SO-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.75

  • Avalanche Energy Rating (Eas):

    171 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.06 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS3692 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDS3692 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To ensure the FDS3692 operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C. Also, ensure the input voltage is within the recommended range of 4.5V to 18V, and the output current is within the recommended range of 0A to 2A.
  • The recommended input capacitor value for the FDS3692 is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor such as X5R or X7R is recommended due to its low equivalent series resistance and high reliability.
  • To troubleshoot issues with the FDS3692, start by checking the input voltage and current, output voltage and current, and device temperature. Use an oscilloscope to check for voltage ripple or oscillations. Verify that the device is properly soldered and that the PCB layout is correct. Check for any signs of physical damage or contamination. If the issue persists, consult the onsemi application note or contact their technical support.
  • Yes, the FDS3692 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade devices and is manufactured using a robust process that ensures high reliability. However, it's essential to follow the recommended operating conditions, PCB layout, and thermal management guidelines to ensure the device operates within its SOA.

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FDS3692 Overview

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