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FIN3386MTDX - onsemi

Description: Low-Voltage, 28-Bit, Flat-Panel Display Link Serializer / Deserializer -40 to +85°C 56-Lead TSSOP,3.6V

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PCB Footprints
FIN3386MTDX - onsemi PCB footprint - Other - Other - 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,6.1mm Wide
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FIN3386MTDX Details

  • Manufacturer Part Number:

    FIN3386MTDX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-56

  • Package Description:

    TSSOP-56

  • Manufacturer Package Code:

    948BR

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    DESERIALIZER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

FIN3386MTDX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range.
  • Use a pi-filter or a common-mode choke to reduce EMI. Add capacitors (e.g., 10nF, 100nF) between the input and output pins to ground to filter high-frequency noise. Ensure a low-impedance return path for the output current.
  • Choose an output capacitor with low ESR (e.g., ceramic or polymer capacitors). Optimize the output inductor value and DC resistance to minimize voltage ripple. Consider adding a snubber circuit to reduce ringing.
  • Select an input capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. Ensure the capacitor is placed close to the device's input pins.

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FIN3386MTDX Overview

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