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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for FJD5553TM
- Part Number FJD5553TM
- Manufacturer onsemi
- Pin Count 3
- Last Modified Date Sep 14, 2026 4:56 PM UTC
- Pinout / Pin List Click Here (Member Only)
FJD5553TM Details
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Manufacturer Part Number:
FJD5553TM
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Brand Name:
onsemi
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
DPAK-3 / TO-252-3
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Manufacturer Package Code:
369AS
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Factory Lead Time:
10 Weeks
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Manufacturer:
onsemi
FJD5553TM Frequently Asked Questions (FAQs)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
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Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
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Monitor the device's junction temperature, voltage, and current. Implement over-temperature protection, over-voltage protection, and over-current protection to prevent damage.
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Use a gate driver with a high current capability (>1A) and a low output impedance. Ensure the gate drive voltage is within the recommended range (10-15V) and the rise/fall times are <10ns.
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Implement ESD protection diodes (e.g., TVS diodes) on the input and output pins. Use a PCB layout with a solid ground plane and a Faraday cage structure to minimize ESD susceptibility.
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FJD5553TM Overview
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