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FL3100TMPX - onsemi

Description: Typical Propagation Delay Time Under 20 ns with Input Falling or Rising; Non-inverting Input Logic with DIM Control Input for PWM Dimming Down to 0.1% for Hybrid Dimming; 13 ns Typical Rise Time and 9 ns Typical Fall-Time with 1 nF Load; 4.5 to 18 V Operating Range; Internal Resistors Turn Driver Off If No Inputs; 2.5 A Sink / 1.8 A Source at VOUT = 6 V; Rated from -40°C to 125°C Ambient; 6-Lead, 2 x 2 mm MLP or 5-Pin, SOT23 Packages; TTL Inputs Independent of Supply Voltage; MillerDrive™ Technology

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Symbol
FL3100TMPX - onsemi - PCB symbol
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PCB Footprints
FL3100TMPX - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - MLP 2X2 6L_3
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FL3100TMPX - onsemi - 3D model - Small Outline No-lead - MLP 2X2 6L_3
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FL3100TMPX Details

  • Manufacturer Part Number:

    FL3100TMPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    MLP-6

  • Manufacturer Package Code:

    511CY

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.88 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

FL3100TMPX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect it to the copper area.
  • The FL3100TMPX requires a bias voltage of 2.5V to 5.5V on the VCC pin. A decoupling capacitor of 10uF or larger should be placed close to the VCC pin to filter out noise. Additionally, the input pins should be biased to a voltage within the recommended range to ensure proper operation.
  • The FL3100TMPX is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures. It is recommended to operate the device within the recommended temperature range for optimal performance.
  • The FL3100TMPX is a sensitive device and requires ESD protection. Handling the device by the body or using an ESD wrist strap can prevent damage. Additionally, the device should be stored in an anti-static bag or tube to prevent ESD damage during storage and shipping.
  • The recommended soldering profile for the FL3100TMPX is a peak temperature of 260°C for 10-30 seconds. The device should be soldered using a soldering iron with a temperature-controlled tip to prevent overheating.

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FL3100TMPX Overview

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