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FODM452R2 - onsemi

Description: Orering option V, e.g., FODM452V; Performance guaranteed over temperature (0-70°C); U.L. recognized (File # E90700); High speed-1 MBit/s; Compact 5-pin mini flat package; VDE0884 recognized (File # 136480); Superior CMR-15kV/µs at VCM = 1500V (FODM453)

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FODM452R2 Details

  • Manufacturer Part Number:

    FODM452R2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-5

  • Package Description:

    SOP-5

  • Manufacturer Package Code:

    100AM

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    CMOS COMPATIBLE, UL RECOGNIZED

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    15%

  • Data Rate-Nom:

    1 MBps

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    1.8 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.008 A

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.1 W

  • Response Time-Max:

    8e-7 s

  • Response Time-Nom:

    3.5e-7 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM452R2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pour on the bottom layer for heat dissipation.
  • Implement a heat sink with a thermal interface material, ensure good airflow, and consider using a thermistor or thermocouple to monitor the device temperature. Also, follow the recommended derating curves for the device.
  • Use a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Ensure the protection circuit is placed close to the device and connected to a low-impedance ground plane.
  • Use a multi-layer PCB with a solid ground plane, keep high-frequency traces short and away from the device, and use a shielded enclosure. Also, consider using a common-mode choke or ferrite bead to reduce EMI.
  • Use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. For rework, use a hot air rework station with a temperature range of 200°C to 250°C.

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FODM452R2 Overview

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FODM452R2 Alternates

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Part Image FODM452V Fairchild Semiconductor Corporation

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Part Image FODM452 Fairchild Semiconductor Corporation

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Part Image FODM452R2V Fairchild Semiconductor Corporation

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For a full list of alternate parts for FODM452R2, check out Findchips.com