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FPF2702MPX - onsemi

Description: Power Switch ICs - Power Distribution AccuPower Advanced Load Mngmnt Products

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FPF2702MPX - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - FPF2702MPX
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FPF2702MPX - onsemi  - 3D model - Small Outline No-lead - FPF2702MPX
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FPF2702MPX Details

  • Manufacturer Part Number:

    FPF2702MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MLP-8

  • Manufacturer Package Code:

    511DD

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    0.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    2.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

FPF2702MPX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • The FPF2702MPX requires a bias voltage of 2.5V to 5.5V on the VCC pin. A 0.1uF decoupling capacitor should be placed close to the VCC pin to filter out noise. Additionally, a 1uF capacitor should be placed between the VIN pin and GND to filter out input noise.
  • The maximum input voltage that can be applied to the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • The output voltage of the FPF2702MPX is adjustable and can be calculated using the following formula: VOUT = (R1/R2) * (VIN - VREF), where R1 and R2 are the resistors connected to the FB pin, VIN is the input voltage, and VREF is the internal reference voltage (1.25V).
  • The maximum output current that the FPF2702MPX can supply is 2A. Exceeding this current may cause the device to overheat or malfunction.

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