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FSAL200QSCX - onsemi

Description: FSAL200QSCX, Quad Demultiplexer, Multiplexer SCX, 1-of-2 3-State 3 → 5.5 V 16-Pin QSOP

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Symbol
FSAL200QSCX - onsemi - PCB symbol
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PCB Footprints
FSAL200QSCX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - QSOP 16-Lead
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FSAL200QSCX - onsemi - 3D model - Small Outline Packages - QSOP 16-Lead
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FSAL200QSCX Details

  • Manufacturer Part Number:

    FSAL200QSCX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QSOP-16

  • Manufacturer Package Code:

    492-01

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    FSA

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    MULTIPLEXER AND DEMUX/DECODER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Inputs:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.001 mA

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FSAL200QSCX Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • A ceramic capacitor with a value of 1-10uF is recommended for input decoupling. The capacitor should be placed as close as possible to the VIN pin and have a low ESR (Equivalent Series Resistance) to minimize voltage ripple.
  • Use a voltage regulator or a TVS (Transient Voltage Suppressor) diode to protect the device from overvoltage conditions. For overcurrent protection, consider using a fuse or a current-sensing resistor with a comparator to detect overcurrent conditions and disconnect the power supply.
  • Use a multi-layer PCB with a solid ground plane to minimize radiation. Keep the power supply traces short and away from sensitive analog signals. Use shielding or a metal enclosure to contain EMI emissions. Additionally, consider using EMI filters or common-mode chokes to reduce emissions.

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FSAL200QSCX Overview

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